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A delegation from the Ministry of Science and Technology visited Da Nang and attended the Launching Ceremony of the Advanced Packaging Technology Laboratory Project at Da Nang Software Park No. 2.

On July 28, 2025, a delegation from the Ministry of Science and Technology, led by...

SUMMARY OF DA NANG SEMICONDUCTOR DAY 2025

On August 30, 2025, within the framework of the Da Nang Finance and Technology Week...

VSAP Lab – Pioneering Vietnam’s Advanced Packaging Breakthrough

In the fast-moving global race for semiconductor and AI leadership, Vietnam is emerging as a...

More than 2,000m2 of area for advanced semiconductor packaging technology project in Da Nang

Da Nang – Laborator project serving the production of advanced packaging technology for semiconductor microchips with...

First advanced packaging project to be built in Đà Nẵng

ĐÀ NẴNG – The central city’s people’s committee has agreed an investment proposal on the...

Advanced chip packaging FabLab project launched in Da Nang

The nearly $69-million project will be constructed on a 2,288-sq.m plot, with a total usable...

VND 1.8 trillion advanced semiconductor packaging lab project gets off the ground in Da Nang

DNO – Work on the Advanced Semiconductor Packaging Laboratory (Fab-Lab) project, located at the Da...