At SEMIEXPO Vietnam 2025, VSAP Lab (Vietnam Semiconductor Advanced Packaging Lab-Fab) had the great honor of welcoming Deputy Prime Minister Nguyen Chi Dung and Vice Chairman of Da Nang People’s Committee Ho Quang Buu to visit its exhibition booth.
The attention and encouragement from the Government and city leadership serve as a strong motivation for VSAP Lab to continue developing its Lab-Fab facility combining R&D and pilot manufacturing for “Make in Vietnam” semiconductor packaging prototypes, expanding international cooperation in the supply chain, and contributing to Vietnam’s semiconductor workforce development.
VSAP Lab is Vietnam’s first Lab-Fab in the field of advanced semiconductor packaging – a strategic link in the global semiconductor value chain. The project was founded by a team of experienced Vietnamese-origin experts working in leading semiconductor corporations across the U.S., Japan, Korea, and Taiwan, united by a shared mission to bring core technology back to Vietnam.
With hundreds of international patents and scientific publications among its founding members, VSAP Lab focuses on R&D and turnkey solutions in advanced packaging – a field forecasted to be at the heart of the next wave of global semiconductor innovation. The Lab-Fab model enables VSAP Lab to conduct research, training, and commercialization within one ecosystem, laying the foundation for a complete domestic semiconductor ecosystem.
The project’s Groundbreaking Ceremony took place on July 28, 2025, at Da Nang Software Park No.2, attended by the Minister of Science and Technology and the Chairman of Da Nang People’s Committee. The facility is being constructed on a 2,288 m² site, with four floors housing functions for R&D, pilot production, training, and scientific conferences.
Notably, the facility includes ISO-certified cleanrooms ranging from Class 10,000 / Class 1,000 up to Class 100, equipped for a full spectrum of advanced packaging processes—from wafer-level to substrate-level assembly.
The construction Is expected to be completed by Q1 2026, with full operational capacity by Q2 2026. In parallel with the rapid completion of the Lab-Fab facility to achieve 100% local process capability by 2026, VSAP Lab’s expert team is currently developing semiconductor packaging design projects and collaborating with international partners for pilot production to serve VSAP Lab’s customers.
At SEMIEXPO Vietnam 2025, the VSAP Lab booth presented the business model and unique value of the Lab-Fab concept, the technology roadmap for advanced packaging from 2D to 3D integration (including RDL, silicon interposer, and hybrid bonding), and the vision toward chiplet-based architectures and high-density packaging for next-generation applications.
The CEO of VSAP Lab also delivered a keynote speech outlining VSAP Lab’s strategic contribution to Vietnam’s semiconductor workforce development, and shared a vision to establish Da Nang as a center for R&D and pilot testing in semiconductor packaging — an essential link in Vietnam’s deeper integration into the global semiconductor value chain.
The VSAP Lab booth attracted significant attention from international material, equipment, and cleanroom infrastructure suppliers, as well as from electronics companies, universities, and research institutes exploring advanced packaging applications for next-generation smart devices.
Phuc Le
Tiếng Việt