On January 28 in Hanoi, FPT Group officially announced the establishment of FPT Semiconductor’s Advanced Semiconductor Testing and Packaging Factory – the first advanced semiconductor testing and packaging facility in Vietnam that is fully owned and operated by Vietnamese enterprises. This milestone not only marks a significant achievement for FPT itself, but is also widely regarded as a strategic step toward completing Vietnam’s national semiconductor ecosystem.
In this context, VSAP Lab was very pleased to attend the Announcement Ceremony and to sign a Memorandum of Understanding (MOU) with FPT Semiconductor, opening a new chapter of close collaboration in research and development (R&D), workforce training, and business development in the field of advanced semiconductor packaging and testing.
A Major Milestone for Vietnam’s Semiconductor Ecosystem
Speaking at the event, Mr. Truong Gia Binh, Chairman of FPT Group, emphasized:
“If a nation wants to become prosperous, there is no other path than mastering chip technology. If we count Vietnamese people around the world, we are a real force in the global semiconductor industry. Our biggest challenge is to connect and unite, to build our own ecosystem.”
According to Mr. Binh, with the launch of an advanced testing and packaging factory, Vietnam has taken an important step toward closing the semiconductor value chain – from research and design to manufacturing, testing, packaging, and commercialization.
The FPT Advanced Semiconductor Testing and Packaging Factory is expected to become a leading advanced testing and packaging center in the region. In Phase 1 (2026–2027), the factory will be located in Yen Phong II-C Industrial Park, Bac Ninh Province, covering approximately 1,600 square meters. It will include six functional test lines and a dedicated area for reliability testing and specialized durability evaluation.
All systems are designed to comply with international management and technical standards such as ISO 9001, ISO 14001, IATF 16949, as well as semiconductor-specific standards including JEDEC, AEC-Q100, and AEC-Q101, ensuring high product quality, stability, and reliability.
In Phase 2 (2028–2030), FPT plans to expand the factory to approximately 6,000 square meters, invest in 18 additional functional test lines, expand reliability testing areas, and deploy packaging lines ranging from traditional packages (QFN, QFP, DFN) to CSP, WLP, and advanced IC packaging technologies, targeting an annual capacity of billions of semiconductor products.
The Role of VSAP Lab in the Partnership Landscape
At the ceremony, Ms. Bich-Yen Nguyen, Chairwoman of VSAP Lab and a member of the Institute of Electrical and Electronics Engineers (IEEE), shared a strategic perspective on the critical role of advanced packaging and testing in the semiconductor value chain. She noted:
“Vietnam is not just talking about semiconductors – Vietnam is taking coordinated and serious action. Leading enterprises are driving the ecosystem forward through real commitments and concrete implementation. In this landscape, FPT stands out as a major pillar, not only enhancing technological capability but also playing a connecting, leading, and trust-building role for the entire ecosystem.”
Positioned as a Lab–Fab model for advanced semiconductor packaging, VSAP Lab focuses on technology research, process development, experimentation, and prototyping, before transferring technologies and scaling up production together with industrial partners. The signing of the MOU with FPT Semiconductor represents the convergence of two highly complementary visions: FPT’s strength in industrial-scale manufacturing, testing, and commercialization, and VSAP Lab’s deep R&D expertise, advanced packaging technology development, and high-quality talent training.
Key Areas of Collaboration: R&D – Training – Business Development
Under the MOU, VSAP Lab and FPT Semiconductor will focus their collaboration on three main pillars.
First, research and development (R&D). The two parties will jointly research and develop advanced semiconductor packaging and testing technologies, optimize processes, and enhance product performance and reliability. R&D efforts will focus on semiconductor solutions for IoT, Automotive applications, and AI-on-the-edge SoCs, aligning with global trends in smart systems and edge AI.
Second, workforce training and talent development. VSAP Lab and FPT will co-develop hands-on training programs that closely integrate research with manufacturing practice. These programs aim to enable Vietnamese engineers to directly access and master advanced packaging and testing technologies in line with international standards. This is considered a key factor for Vietnam not only to participate in, but also to gradually take ownership of higher-value segments of the global semiconductor supply chain.
Third, business development and commercialization. Leveraging R&D outcomes and combined manufacturing and testing capabilities, both sides will collaborate to bring products to market, connect with domestic and international partners, and contribute to the creation of globally competitive “Make in Vietnam” semiconductor products.
Joining Forces to Master Core Technologies
At the event, Mr. Bui Hoang Phuong, Deputy Minister of Science and Technology, affirmed that FPT’s investment in an advanced semiconductor testing and packaging factory has completed a missing piece of Vietnam’s semiconductor ecosystem. This concrete project demonstrates strong commitment and contributes to realizing Vietnam’s aspiration to bring Vietnamese intelligence to the world and strengthen the country’s position on the global semiconductor map.
In this broader context, the collaboration between VSAP Lab and FPT is regarded as a representative example of an integrated model linking R&D, manufacturing, training, and commercialization, in line with Vietnam’s orientation toward developing a sovereign and resilient semiconductor industry.
Alongside its partnership with VSAP Lab, FPT has also signed cooperation agreements with Viettel, Restar, Winpac, and other partners, forming an interconnected network spanning design, fabrication, testing, packaging, and commercialization. Notably, FPT’s R&D roadmap for AI-on-the-edge SoCs targeting applications such as cameras, drones, and unmanned aerial vehicles (UAVs) reflects its ambition to fully master the smart device ecosystem.
Looking Ahead
The collaboration between VSAP Lab and FPT Group goes beyond a bilateral agreement. It represents a concrete step toward building Vietnam’s internal capabilities in the semiconductor industry, particularly in advanced packaging and testing – areas where Vietnam has strong potential to leap forward. By combining VSAP Lab’s deep R&D strengths with FPT’s execution and commercialization capabilities, both parties aim to create sustainable long-term value, make meaningful contributions to Vietnam’s semiconductor ecosystem, and gradually position Vietnam as an emerging and credible player in the global semiconductor value chain.
Tiếng Việt